プリント基板材料 - F4BTMS-2 セラミック製フィラー付きガラス製テフロン銅積層板

Types

F4BTMS-2

Dielectric Constant

2.2±0.03 2.65±0.04   2.94±0.04 3.0±0.04

Dimension(mm)

305X460 460X610 500X600   460X1220

For special dimension，customized   laminates is available.

Thickness  and Tolerance(mm)

Dielectric thickness

0.127

0.254

0.508

0.762

1.016

1.524

2.29

Tolerance

±0.015

±0.02

±0.03

±0.04

±0.05

±0.05

±0.08

Special thickness can be   customized.

Optional copper foil

Thickness: 0.5 OZ 、1OZ

Type: ED、VLP   foil、HVLP foil、50 Wresistive foil

Mechanical Strength

Peel strength (1oz   copper)

>15N/cm

Thermal stress

After tin dipping, 280°C,   10s, ≧3times，no de-lamination and blister.

Chemical Property

According to the   properties of laminate，the chemical etching method for PCB can be used. The dielectric   properties of laminate are not changed.

Density

DK2.2

Normal atmospheric   temperature

g/ cm3

2.18

DK2.65

Normal atmospheric   temperature

g/ cm3

2.25

DK2.94、3.0

Normal atmospheric   temperature

g/ cm3

2.3

Moisture Absorption

Dip in the distilled   water of 20±2°C for 24 hours

%

0.02

Operating Temperature

High-low temperature   chamber

°C

-50~+260

Thermal Conductivity

W/m/k

0.72

CTE (typical)

-55 o~288oC DK2.2

ppm/oC

X

Y

Z

15

16

35

-55 o~288oC DK2.65

ppm/oC

X

Y

Z

12

13

25

-55 o~288oC DK2.94、3.0

ppm/oC

X

Y

Z

10

11

22

Shrinkage Factor

2 hours in boiling water

%

 <0.0002

Surface Resistivity

500V DC

Normal state

M.Ω

≥1×107

Constant humidity and   temperature

≥1×106

Volume Resistivity

Normal state

MΩ.cm

≥1×108

Constant humidity and   temperature

≥1×107

Thermal Coefficient of εr

-50 o~150oC

PPM/ oC

-20

Dissipation Factor   DK2.2/2.65/2.94/3.0

10GHZ

Df

0.0011

UL Flammability Rating

94V-0